( PR4US.com | Press Release | 2017-05-12 23:19:49 )
The growth of the market is driven by the factors such as the demand for high-speed connectivity and transmission bandwidth and low and stable raw material cost required for the manufacturing.
The wire-to-board connector design ranges from miniature to large and heavy-duty industrial connectors and also satisfies the economical requirements. This simplifies the issues related to manufacturing, maintenance, and repair where it can rapidly replace specific, affected subsystems, thereby reducing machine downtimes.
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The wire-to-board connector market has different style and pitch size for various applications. The connector by styles includes accessory, header, housing, plug, receptacle, and socket. Among all these, the housing market is the third-largest market and is expected grow at the highest CAGR during the forecast period.
The wire-to-board connector pitch size market can be segmented into 12 different sizes, varying from 0.8mm to 10.16mm. These connectors are having various applications defined by their pitch size; for instance, 0.8 mm connectors are mostly used in communication (router), IP phone instrumentation industries (office equipment and test and measurement), and so on. 2.54mm pitch size connectors held the largest market size in 2015.
Furthermore, the fastest-growing applications and the major consumers of the wire-to-board connectors are data/telecom and automotive sectors. The increasing number of data centers, in turn, is driving the market. The connectors used in data/telecom sectors would experience a huge growth in the near future as potential that IoT sector holds with a variety of applications.
The APAC region accounted for the largest share of the total market in 2016 and is also expected to grow at the highest rate between 2016 and 2022. The market in this region is rapidly growing with IoT as a major segment which mainly focuses on the control and process control levels and requires embedded processors at the field level.
The speedy growth of computer, communication, and consumer electronics brands is the factor inhibiting the growth of this market. Furthermore, the APAC region has emerged as a major manufacturing hub for the consumer electronic industry and deployed a large number of networks; this has led to account for the largest market share in terms of the value.
However, growth in wireless networking systems is the main challenging factor for this market in the near future. The key players in the market are TE Connectivity (Switzerland), Molex Incorporated (US), Amphenol Corporation (U.S.), Samtec, Inc. (U.S.), Japan aviation Electronic Industry, Ltd. (Japan), and Kyocera Corp. (Japan), among others.
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